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AI IntelligenceAug 29, 2026Secondary Market
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SK Hynix broke ground on a $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM expected to begin in H2 2029. The investment expands U.S.-based advanced memory supply for AI workloads.

Data Cube AI EditorialSource: techmeme.com
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SK Hynix broke ground on a $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM expected to begin in H2 2029. The investment expands U.S.-based advanced memory supply for AI workloads.